DESENVOLVEDOR PACKAGING FOTONICO PL

Descrição

Summary: Seeking a Packaging Product Development Engineer focused on optical commutations to contribute to the hardware lifecycle of photonic modules, bridging design with manufacturing reality. Highlights: 1. Key technical contributor in optical commutations products 2. Hands-on role bridging R&D design with manufacturing reality 3. Focus on yield optimization and troubleshooting **JOB MISSION** HwIT is seeking a Packaging Product Development Engineer focused on optical commutations products. You will be a key technical contributor supporting the hardware lifecycle of our photonic modules — from assisting in mechanical/thermal simulations and 3D CAD design to the execution, validation, and optimization of cleanroom packaging processes. Your main focus will be a hands\-on environment bridging RD design with manufacturing reality: supporting multiphysics simulations, detailing micro\-assemblies, executing DOEs (Design of Experiments) for method validation, and technically investigating root causes to ensure structural integrity and maximize yield in global scale production. **SCOPE RESPONSIBILITIES** **1\. Product Development and Validation** * **Mechanical Optomechanical Design for Packaging:** Develop 3D CAD models and detailed 2D manufacturing drawings for high\-precision optoelectronic packages, test fixtures, and structural assemblies, applying GDT standards. * **Multiphysics Thermal Simulation:** Conduct Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) to simulate thermal dissipation, mechanical stress, and structural integrity of photonic modules. * **Prototyping Design Validation:** Support the rapid prototyping phase and work closely with the Reliability testing team to validate simulation models against empirical data from testing (e.g., Telcordia GR\-468, MIL\-STD). **2\. Process Development and Validation** * **Critical Parameter Optimization:** Assist in defining and optimizing critical process parameters such as die attach (e.g., conductive epoxies, eutectic soldering), wire bonding, and optical alignment. * **Encapsulation Techniques:** Develop hermetic and semi\-hermetic encapsulation techniques for photonic modules. * **Material Qualification:** Validate new materials, adhesives, and sealing processes according to high\-reliability standards. **3\. Yield Optimization and Troubleshooting** * **Root Cause Investigation:** Run investigative activities in cleanroom processes to detect the root cause of issues affecting the yield and assembly times of photonic components. * **Design of Experiments (DOE):** Run DOEs to characterize processes, define critical variables, and find the best assembly recipes. * **SPC Alignment:** Validate and approve operational methods and process parameters consistent with the Statistical Process Control (SPC) required by Product Engineering. **4\. NPI Integration and Manufacturability** * **Design for Manufacturing (DFM):** Execute DFM and development activities in packaging components under senior guidance, promoting technical alignment between suppliers and developers, and evaluating the technical feasibility of new components. * **Team Training:** Documentation and training the operational team in the meticulous execution of complex encapsulation recipes and methodologies; * **Process Transference:** Collaborate side\-by\-side with Product Engineers and Senior Packaging Engineers to validate assemblies and transfer packaging assembly processes to high\-volume manufacturing sites. **CANDIDATE PROFILE** **Education Background** **Essential:** * Bachelor's Degree in Materials Engineering, Mechanical Engineering, Electronics, Physics, or related fields. * Minimum of 2–5 years of solid experience in microelectronic or optoelectronic packaging processes. * Knowledge of structural adhesives, precision soldering, and interconnect metallurgy. * Familiarity with failure analysis methodologies (SEM, EDS, X\-Ray, Cross\-section). * Experience in optomechanical design, precision mechanics, or electronic hardware packaging. * Proficiency in 3D CAD software (e.g., SolidWorks, Creo, Inventor) and understanding of GDT. * Track record participating in thermal and structural simulations using tools like ANSYS, COMSOL, or SolidWorks Simulation. **Desirable:** * Experience with PICs (Photonic Integrated Circuits) and fiber\-to\-chip interfaces. * Knowledge of reliability standards (MIL\-STD\-883, Telcordia GR\-468, or NASA EEE\-INST\-002\). * Experience with continuous improvement tools (Six Sigma, Lean Manufacturing). * Knowledge of automation programming in Python, C\#, or LabVIEW. * Experience designing complex hermetic packages (e.g., Butterfly, TO\-can) and managing micro\-assembly tolerances. * Background in designing customized mechanical fixtures for High\-Temperature Operating Life (HTOL) and environmental testing. **Languages** * **Portuguese:** Native; * **English:** Mandatory — Advanced/Fluent (B2/C1 level) for day\-to\-day communication with international partners. * **Spanish:** Desirable.