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Summary: Seeking a Senior Photonic Packaging Engineer to lead the entire hardware lifecycle of optical commutations products, bridging RD design with manufacturing reality through simulation, design, and process optimization. Highlights: 1. Lead hardware lifecycle for photonic modules, from simulation to optimization. 2. Drive multiphysics simulations and robust micro-assembly designs. 3. Optimize processes, troubleshoot yield, and integrate new products. **JOB MISSION** HwIT is seeking a Packaging Senior Photonic Packaging Engineer focused on optical commutations products. You will be the technical lead responsible for the entire hardware lifecycle of our photonic modules — from advanced mechanical/thermal simulations and 3D CAD design to the absolute definition, validation, and optimization of cleanroom packaging processes. Your main focus will be a highly specialized hands\-on environment bridging RD design with manufacturing reality: conducting multiphysics simulations, designing robust micro\-assemblies, executing complex DOEs (Design of Experiments) for method validation, and technically investigating root causes to ensure structural integrity and maximize yield in global scale production. * **Product Development and Validation** * **Mechanical Optomechanical Design for Packaging****:** Develop 3D CAD models and detailed 2D manufacturing drawings for high\-precision optoelectronic packages, test fixtures, and structural assemblies, applying strict GDT (Geometric Dimensioning and Tolerancing) standards; * · **Multiphysics Thermal Simulation:** Conduct advanced Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) to simulate thermal dissipation, mechanical stress, and structural integrity of photonic modules subjected to extreme environmental and operational conditions;· * **Prototyping Design Validation:**Lead the rapid prototyping phase and work closely with the Reliability testing team to validate simulation models against empirical data from thermal cycling, vibration, and mechanical shock tests (e.g., Telcordia GR\-468, MIL\-STD). **2\. Process Development and Validation** **Critical Parameter Optimization:** Define and optimize critical process parameters such as die attach (e.g. conductive epoxies, eutectic soldering), wire bonding, and optical alignment. **Encapsulation Techniques:** Develop hermetic and semi\-hermetic encapsulation techniques for photonic modules. **Material Qualification:** Validate new materials, adhesives, and sealing processes according to high\-reliability standards. **Resource Planning:** Define materials and resources required to execute packaging processes in both laboratory and production environments. **3\. Yield Optimization and Troubleshooting** **Root Cause Investigation:** Lead investigative activities in cleanroom processes to detect the root cause of issues affecting the yield and assembly times of photonic components. **Design of Experiments (DOE):** Plan and lead DOEs to characterize complex processes, define critical variables, find the best assembly recipes, and widen operational windows. **SPC Alignment:** Validate and approve operational methods and process parameters consistent with the Statistical Process Control (SPC) required by Product Engineering. **4\. NPI Integration and Manufacturability** **Design for Manufacturing (DFM):** Lead DFM activities, executing development activities in packaging components, promoting technical alignment on photonic projects between suppliers and developers, defining requirements, and evaluating the technical feasibility of new components; **Team Training:** knowledge transference and training the operational team in the meticulous execution of complex encapsulation recipes and methodologies; **Process Transference:** Collaborate side\-by\-side with Product Engineers to validate assemblies and guarantee the technical success of transfer activities to industrial scale. Transfer packaging assembly processes to high\-volume manufacturing sites at the quality targets. **Education Background** Bachelor's or Master's Degree in Materials Engineering, Mechanical Engineering, Electronics, Physics, or related fields; Minimum of 5–8 years of solid experience in microelectronic or optoelectronic packaging processes. Deep knowledge of structural adhesives, precision soldering, and interconnect metallurgy; Mastery of failure analysis methodologies (SEM, EDS, X\-Ray, Cross\-section); Proven engineering experience in optomechanical design, precision mechanics, or electronic hardware packaging; Advanced proficiency in 3D CAD software (e.g., SolidWorks, Creo, Inventor) and strong mastery of GDT; Solid track record executing thermal and structural simulations using tools like ANSYS, COMSOL, or SolidWorks Simulation. **Desirable:** Experience with PICs (Photonic Integrated Circuits) and fiber\-to\-chip interfaces. Knowledge of reliability standards (MIL\-STD\-883, Telcordia GR\-468, or NASA EEE\-INST\-002\). Experience with continuous improvement tools (Six Sigma, Lean Manufacturing). Knowledge of automation programming in Python, C\#, or LabVIEW. Experience designing complex hermetic packages (e.g., Butterfly, TO\-can) and managing micro\-assembly tolerances for wire\-bonding/die\-attach clearances. Background in designing customized mechanical fixtures for High\-Temperature Operating Life (HTOL) and environmental testing. **Languages** * **English:** Mandatory — Fluent (C1/C2 level) for day\-to\-day communication with international partners;
