




Job Summary: Ensure efficiency and quality in component assembly on PCBs, optimizing the process flow from solder paste application to final inspection. Key Highlights: 1. Configure and program Pick and Place machines and reflow ovens 2. Analyze and improve cycle times and line efficiency (OEE) 3. Monitor optical inspection systems (AOI) and solder paste inspection systems (SPI) **Job Description** Ensure efficiency and quality in the surface-mount technology (SMT) process—mounting components directly onto printed circuit board (PCB) surfaces—optimizing the process flow from solder paste application to final inspection. * Configure and program *Pick and Place* machines, solder paste printers (stencil printers), reflow ovens, and other equipment. * Analyze and improve cycle times and line efficiency (OEE), ensuring minimal unplanned downtime. * Perform preventive and corrective maintenance on SMT line equipment. * Monitor automated optical inspection (**AOI**) and solder paste inspection (**SPI**) systems to identify defects such as short circuits or missing components. * Ensure proper storage and handling of moisture- and temperature-sensitive components. **Job Requirements** * Technical or Bachelor’s degree in Electronics, Mechatronics, Automation, or related fields. * Experience with leading machine brands (e.g., Panasonic, Fuji, ASM/SIPLACE, or Yamaha). * Ability to read and interpret electrical schematics and technical diagrams. * Preferred: familiarity with international electronic quality standards, such as **IPC-A-610**. * Advanced English proficiency is desirable. Minimum Education Level: Bachelor’s Degree Languages: * English (Intermediate)


